PTH08T220W: insufficient solder The marked components have little or no visible solder on the contacts on three sides of the component.

Hi John,

Let me reach out to our Quality Engineers to provide you with an answer as soon as possible. In the meantime, I have a few questions, is the product working properly? Or is this a visual and performance matter due to the exposed copper?

Regards,
Alejandro

We dont test this so don't know if it is working yes a visual inspection per IPC.  We have seen this before on previous shipment but looks to be different date code.  this lot is from 1901.  older ones were 1844 and 1636.

Hi John,

Yes, TI complies with IPC 610 standards. The IPC-A-610-SP indicates in 8.3.13 that "There are some package configuration that have no toe exposed or do not have a continuous solder able surface on the exposed toe on the exterior of the package, and toe fillet will not form."
Our Quality Engineers did some inspections on devices we have on our end and they had to meet the following requirements:

1. Solder wetting is not required on trimmed edges of a terminal plane that expose non-wettable vertical surface.
2. The end joint width is greater than 75% of connection.

The image you provided is not very clear to determine if it is acceptable. Could you please provide a similar picture like the one I've attached below as an example?

Thanks,
Alejandro

Hi Alejandro,

Thanks for looking into this for me.  Does this view help you see the pads better?

Hi John,

It helps just a bit. I tried editing the photo to get less lighting but I don't think that's sufficient for us to ensure that the reported condition is acceptable. Can you capture a 50X zoom photo just like the one I demonstrated previously?

Thanks,
Alejandro

What is the orange color?  It looks like these is a very small amount of solder under the chip, is that sufficient?