Other Parts Discussed in Thread: UCC27524
My customer is using UCC27524 as their secondary side low side drivers.
In datasheet, we only give the thermal resistance of Junction-top case, but not give the value of Junction-bottom case.
- Why does not the datasheet offer the value of thermal resistance of junction-bottom case with SOIC8 package?
- When the temperature of top side and bottom are different, what is the thermal circuit model look like? How to calculated the junction temperature?
- As the value of thermal resistance of junction-bottom case is much lower the junction-top side one, so the temperature of bottom side will be lower. Customer wonders that, how to measure the bottom side package temperature of UCC27524? And, the most important, what is the proper way to evaluate the thermal performance of this IC?