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CSD87384M: Max solder thickness

Part Number: CSD87384M

Hi there:

I'd like to check a question for our customer about solder thickness for MPB package.

as we can find a specific 0.08 in data sheet.

but from slma007 this document, the figure 5, target solder thickness after refolw - Die = 50um (25/25um by dome print, On TAB =30um)

how could we understand those two part parameter?

Or 0.08mm is the max value for solder thickness requirement?

  • Hi Kay,

    Thanks for your interest in TI FETs. I am checking with the packaging engineer and will get back to you shortly when I receive his response.

  • Hi Kay,

    Thanks again for your interest in TI FETs. Below is the response I received from the packaging team.

    The 0.08 is Coplanarity spec is not necessarily the solder dome/height. It’s a Coplanarity spec with respect to  plane C. This mean that the die already has a dome in it.

    The drawing (Figure 5) in slma007 corresponds to the SMT solder thickness on the board. When you use a stencil thickness of 100 for example, it was design with an opening such that the total reflowed solder (including the pre-dome solder after reflow) would be 50 um BLT (bond line thickness) and 30 um on the tab.

     The drawing which is a POD (package outline drawing), is a separate spec when we ship the component (not mounted yet on PCB).