LMR33630ADDAEVM: layer thickness and thermal simulation

Adrian Ymeraj

Part Number: LMR33630ADDAEVM

Hello team,

I'm testing the EVM mentioned above but I didn't find on the Datasheet the copper layer thickness. Could you please provide this info? Or at least indicate where to find it?

Also, how can I run a thermal simulation for this device? Do we have any file that I can run ?

Thank you in advance.

Best regards,

Adrian

over 4 years ago

0 Andy Chen over 4 years ago

TI__Mastermind 27045 points

Hi Adrian,

Copper layer thickness is 2oz.

You can simulate thermal performance by Webench on TI website.

0 Adrian Ymeraj over 4 years ago in reply to Andy Chen

TI__Expert 3750 points

Andy,

thanks for the reply! The 4 layers are all the same thickness of 4oz? Or the internal once are of 1oz and the top and bottom are of 4 oz?

On webench we don't have webTHERM anymore so now we can only simulate the junction temperature of the IC, right? I wanted to try a thermal simulation with different areas and thickness of copper. Is there any alternative solution?

Thank you and best regards,

Adrian

0 Andy Chen over 4 years ago in reply to Adrian Ymeraj

TI__Mastermind 27045 points

Hi Adrian,

The internal layers are 1oz and top/bottom layers are 2oz.

Pls send me email at andy.chen@ti.com, I can share you one calculator for thermal resistance.

0 Adrian Ymeraj over 4 years ago in reply to Andy Chen

TI__Expert 3750 points

Hi Andy,

thanks for the reply.

Also I wanted to know if connecting the PG (power good) pin to GND there is a problem or it must be connected to VCC or left open if not used.

Thank you and best regards,

Adrian

0 Andy Chen over 4 years ago in reply to Adrian Ymeraj

TI__Mastermind 27045 points

Hi Adrian,

PG pin can be open or grounded if not use.

Power management

Power management forum

LMR33630ADDAEVM: layer thickness and thermal simulation