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TPS723-Q1: thermal dissipation in the Layout

Part Number: TPS723-Q1

Hello team,

I am designing a supply with TPS72301-Q1. It has 200mA output. I assume thermal dissipation needs to be taken care by increased area of PCB copper. To which pin I should connect those copper, GND, IN or OUT? Usually LDO has a thermal PAD for heat dissipation but it is existing in this LDO. Please advise. Thanks.