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TPS706: TPS706: [TPS70633] can the TPS706xxDRVR (WSON-6 package) LDO be used with a 2 layer PCB ???

Part Number: TPS706

I know that the thermal vias on a WSON-6 package exist inside of the ground thermal pad - can these 2 thermal vias be deleted from the Ultralibrarian model for use on a 2 layer PCB? Or do I need to use the SOT-23-5 package??

thanks

Jim Mrowca

  • Hi James,

    The thermal pad is not required for electrical functionality but not using this will increase the effective TJA of the device. So how well this will work will be a strong function of VIN, VOUT, and the Load current. 

    I hope this answers your question.

    REgards,