I know that the thermal vias on a WSON-6 package exist inside of the ground thermal pad - can these 2 thermal vias be deleted from the Ultralibrarian model for use on a 2 layer PCB? Or do I need to use the SOT-23-5 package??
thanks
Jim Mrowca
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I know that the thermal vias on a WSON-6 package exist inside of the ground thermal pad - can these 2 thermal vias be deleted from the Ultralibrarian model for use on a 2 layer PCB? Or do I need to use the SOT-23-5 package??
thanks
Jim Mrowca
Hi James,
The thermal pad is not required for electrical functionality but not using this will increase the effective TJA of the device. So how well this will work will be a strong function of VIN, VOUT, and the Load current.
I hope this answers your question.
REgards,