Hi team,
My customer have made metal mask for TPS2120 WCSP package.
Although the customer followed following solder paste example, solder bridges were happened (just 2% ICs).
Do you have ideas why it was happened?
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Hi team,
My customer have made metal mask for TPS2120 WCSP package.
Although the customer followed following solder paste example, solder bridges were happened (just 2% ICs).
Do you have ideas why it was happened?
Hi Koyo,
I do not think the use/application of this device is causing the solder bridge due to the 2% event rate.
It is likely that these bridges are happening during board population since the device is small.
Here is a link to the TI FAQ on WCSP packages: http://www.ti.com/support-quality/faqs/wafer-level-chip-scale-package-faqs.html
Hi Shreyas,
Thanks for the advice.
I will confirm whether they use NSMD.
Best regards,
Koyo