Other Parts Discussed in Thread: TPSM84A22
In the datasheet of LMZ31710, it is told not to connect AGND (analog ground) with PGND (common ground) because they are connected internal to the IC.
 What are the reasons for recommending not to connect AGND in PGND?
 Why are Radj and Rrt_clk referenced to ANGD and not to PGND?
I normally maintain one solid ground plane on layer 2 instead of dividing the ground planes. If I follow the recommended layout, I need to divide this solid ground plane. Having different grounds in a circuit board has its own set of problems; so I don't prefer to go to that path.
In the Zynq 7000 SoC EVM (zc-706; reference device - U98), AGND is routed as thick trace in layer 1, while underneath it in layer 2 is a solid PGND ground plane. In such a case, the EM fields of any signal in between Vadj - AGND connection and RT_CLK - AGND connection are contained within the traces on layer 1 and PGND ground below. This means that the PGND ground is referenced anyhow.
 Do you think the way it is routed in Zynq SoC okay?
 I have the exact same question for the routing of Radj between Vadj and AGND in the new power module TPSM84A22.