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ISO5852S: Using AMC1301 for Current sensing along with ISO5852S Gate driver

Part Number: ISO5852S
Other Parts Discussed in Thread: TIDA-00366, AMC1301

Hi,

I am trying to use ISO5852S gate driver for designing a 3 phase Voltage Source inverter to run an induction motor. For the Current sensing I am planning to use AMC1301 Isolation Amplifier with the power supply derived from the respective phase Gate driver, following the design reference TIDA-00366.

So for the layout, since I have some space constraints, my doubt is whether AMC1301 could be placed directly below the respective ISO5852S Gate driver (Gate driver on the Top Layer and the Isolation Amplifier on the Bottom Layer) would it have any issue for the Gate driver circuitry or the Sensing ?

Please give your suggestions.

Thanks.

Regards,

Rohit.

  • Hi, Rohit,

    The ISO5852S is a high-current driver, I don't anticipate any issues on our side due to the layout, but I am very concerned about the layout of the AMC1301.

    I have asked my colleague that supports that device to give you some pointers for success. FYI, we are on holiday here in the US for Thanksgiving, so you may not heard back until early next week.

  • Hi Don,

    Thanks for the reply despite it being a holiday there, glad to hear that the Gate driver won't have issues with the layout, also for forwarding the concern about the AMC1301 to your colleague.

    Hope to get some pointers on the same after the holidays.

    Thanks again. Happy holidays to you.

    Regards,

    Rohit.

  • Hi Rohit,

    As Don mentioned, I apologize for the delay - we were on holiday here in the US. 

    As long as the high and low side of both devices are on the same side of the barrier, I do not see an issue here. 

  • Hey Alexander,

    Glad to get your reply, no problem with the delay, hope you had a good holiday.

    I'm especially delighted to know there won't be any issue with the suggested idea.

    So let me just understand, for R, Y, B phases, the AMC1301 for R phase sensing has to come directly under the corresponding R phase TOP Gate driver ISO5852S; likewise for Y and B phases with the same isolation barrier shared between the low voltage and high voltage side.

    Further the phase to phase isolation also has to be maintained between R, Y and B phase layout for the TOP devices; also the required isolation between the TOP & BOTTOM gate drivers is to be ensured.

    Hope the above understanding covers the requirements to be taken care in the layout, please confirm ?

    Thanks Alexander.

    Regards,

    Rohit.

  • Hi Rohit,

    It was a great holiday, thanks. 

    This is the best approach as it would allow you to power both high sides referenced from the same source with minimal trace length and efficient use of board space. 

    Your second point is correct as well.

    Happy to help and good luck. Let us know how the design goes.  

  • Thanks a lot, Alexander.

    Sure, will get back after testing the design.

    Regards,

    Rohit.