Other Parts Discussed in Thread: DM3730
I'm looking at the PCB layout guide for the TPS65950 (document swcu055a), and in Figure 3 I see a recommended scheme for pads with a trace between them, including a pad diameter of 220 um. What's not clear is how large the soldermask opening should be. My experience with fine-pitch BGAs such as this is that the pads would typically be soldermask-defined. Is there an official recommended footprint for this package (ZXN)? I can't find one on the TI website.
Thanks,
Scott
