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Hello,
I need to check internally and I will let you know.
Hi Alfonso-san,
Thank you for your prompt reply.
I am looking forward to getting the detailed information from you soon.
Best regards,
Kato
Kato-San : The reliability model for humidity modeling is not the same as what is commonly used for silicon power on modeling.
Temperature humidity testing is targeting corrosion and one model used by automotive electronics council is "Hallberg-Peck" where you can find it on page 40 of AEC-Q100 see http://www.aecouncil.com/Documents/AEC_Q100_Rev_H_Base_Document.pdf
Both JEDEC and AEC-Q100 require a minimum qualification of biased humidity testing to be either 1000 hours of 85C THB or 264 hours @ 110C BHAST or 96 hours @ 130C BHAST.
Something else to think about is that for power devices, moisture may get baked out of the devices whilst powered on. So if you have a long power duty cycle, then the devices may be dry after a few hours.
If the pages don't match, refer to Table A7.1 for "Hallberg-Peck" calculation.
Hi Allan-san,
Thank you for the detailed information.
TPS62290 is a power device, so could you please tell us what I need to do specifically if performing the temperature humidity testing for the power devices ?
Best regards,
Kato
I can only give you information on how TIruns biased humidity test which would comply to JESD22 A101 for THB or JESD22 A110 for BHAST.
During the test we aim that a part is < 200mW. During test the device is biased to Vmax but it is not enabled.