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LMZ23610: LMZ23610

Part Number: LMZ23610
Other Parts Discussed in Thread: LMZ31710,

Hello,

I want to use lmz23610tz or lmz31710 to design 12V input and 5V / 8A output. I want to  know whether these two chips need to be equipped with heat sink or other heat dissipation methods,If these two chips do not add heat sink, which chip will have a low temperature? How to calculate it? Thank you!

The analysis results of the two chips I designed with WEBENCH ® power designer are shown in the following two figures

  • Hi,

    If you are wondering which power module will run cooler then the answer is the LMZ23610. This can be quantified from the junction-to-ambient thermal resistance. Intuitively you can compare the package footprint between the LMZ23610 and LMZ31710 and notice that the LMZ23610 has a larger DAP for thermal relief given the same PCB layout solution size.

    If you are wondering if the power module will need an external heat sink, this answer depends on your desired PCB are solution size. Hypothetically if you decide to pick the LMZ23610, you can determine the necessary board area  following Section 10.3. The recommended area for a no airflow/ no external heat sink is calculated using Equation 17

    Regards,

    Jimmy