Hi;
This is with regards to TI P/N: TPS54418RTER
I realise that when I perform x-ray on 2015 device as compare to latest 2019; the wirebonding scheme and layout is different.
I have searched TI PCN for any Die Change; however only managed to locate additional material set of QFN Package., (Mount / Mold Compound).
May I know if TI / Assembly site made a change to their wirebonding scheme either as an improvement or correction? But not sure if there is a PCN in this circumstance as it would not affect Form-Fit-Function?
I need to convince that the 2015 device is the same as latest 2019 part.