Hi Support team
At present, MSOP packaging is used. Would you pls help to check whether there is a temperature difference between the GROUND_PAD at the bottom of the IC and the VIA hole?
Are the values in the table below measured under the layout in Figure 2 below? Then, if LAKOUT cannot punch holes, what are the parameters?
Hello Red,
The values in the datasheet table are tested per JEDEC Standard JESD51-3. It models the IC's thermal behavior given specific conditions (still air) environment surrounding the device.
The vias that need to be connected to the GND pad provide additional heat path between the copper land and ground plane and should typically be 25 mils in diameter. Therefore any temperature difference (if any) might not be a cause for concern given the package can handle significantly higher power than traditional packages.
The app note below and Section 11.3 of the datasheet further discuss in details guidelines and consideration for the powerPAD IC's.
Please let us know if you have additional questions
Regards,
-Mamadou
