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TPS798-Q1: Need recommended layout CAD drawing

Part Number: TPS798-Q1

Hi sir,

I'm looking for document/datasheet which clearly shown correct recommended PCB layout for TPS79801QDGNRQ1.

Very important for me is thermal pad dimensions.

In datasheet I found only component dimensions.

PCB package dimensions can not be found.

I can find a reference files in ultralibrarian.

but I need TI official document.

Thank u.

Regards,

  • Hi,

    There is a recommended layout diagram shown on page 15 of the datasheet.
    Our packaging team generates land patterns to meet class 2 solder joints.
    If you need a land pattern for a class 1 or class 3 solder joint you will need to adjust it accordingly for your needs.
    Many customers need the class 2 solder joint land pattern.

    I have sent you a friend request.
    If you accept and send me a direct email, I can download and provide you the library component from our internal design library.

    Thanks,

    - Stephen

  • Hi,

    Thank you for your response.

    However I need LAND PATTERN EXAMPLE, SOLDER PASTE EXAMPLE just as other package drawings.

    I think this part miss this information in datasheet.

    Can you provide this part of information?

    BTW, I have limited access on TI email.

    If you need, you can send this information to sfgvip126@hotmail.com.

    Thank you in advance.

  • Hi,

    I think I found it from TI websit.

    Thank you for your support.