LM5109B: WSON Coplanarity Data

Darren (FAE)

Part Number: LM5109B

Customer is asking for coplanarity data for the LM5109BSD/NOPB device.

This is WSON(NGT) and I found this E2E post which discusses a 16-pin WSON device.

I quote:

It turns out that the values you see (0.05mm maximum standoff and 0.08mm coplanarity) are specified per JEDEC standards for all WQFN/SON packages. TI follows these standards, and thus these tolerances are included with the package for the DS15BA101.

As such, the DS15BA101 NGQ package will have the same specifications.

As such, is it same to assume that for any WSON package, no matter the pin size, that we meet JEDEC standards and thus have under the maximum coplanarity of 0.08mm?

At the very least, is this LM5109B (WSON) device within JEDEC specs of maximum 0.08mm?

Thanks & Regards,

Darren

over 4 years ago

0 Richard Herring over 4 years ago

TI__Mastermind 21915 points

Hello Darrin,

Thank you for supporting the LM5109B with your customer. I think that your assumptions are likely correct in that TI is following the JDEC standards and would meet the tolerance requirements.

To confirm for sure I will need to reach out regarding this information on the package.

Confirm if this addresses your questions, or if you have additional questions you can post on this thread.

Regards,

0 Darren (FAE) over 4 years ago in reply to Richard Herring

TI__Expert 5483 points

Hi Richard,

Thanks for the reply. I have a customer who needs this info ASAP in order to design in this solution...if you could confirm that would be great.

If possible, if you could also let me know if the packaging group would have the same response for any leadless/ball-less WSON/SON/QFN style package as well, that would be hugely appreciated...

Thanks!

Darren

0 Richard Herring over 4 years ago in reply to Darren (FAE)

TI__Mastermind 21915 points

Hello Darrin,

I have the request out and have received some questions already.

By the questions I was asked (from the packaging) , I don't think they can comment on a wide range of devices package etc, regarding your second question.

Regards,

0 Darren (FAE) over 4 years ago in reply to Richard Herring

TI__Expert 5483 points

Hi Richard,

That is fine then.

As long as I can get the co-planarity and standoff for the LM5109B I'll be good.

Prototype deadline is approaching for the customer, and again, if you could push for a quicker response I would be exteremely grateful.

Darren

0 Richard Herring over 4 years ago in reply to Darren (FAE)

TI__Mastermind 21915 points

Hello Darrin,

I have followed up and the correct resources are looking into the request.

Regards,

0 Darren (FAE) over 4 years ago in reply to Richard Herring

TI__Expert 5483 points

Hi Richard,

Thank you. If possible, please escalate.

I also wanted to add that the WSON package has pins and a thermal pad. If they are both on the same plane, their standoff/coplanarity should be the same. Are they on the same plane?

Also, customer is asking about solder paste % requirements for pad. (% of thermal pad contact surface that is bonded to the pad via solder)

The following document basically mentions QFN/SON recommendation of 50%. Does the WSON fall under the SON category?

https://www.ti.com/lit/an/slua271b/slua271b.pdf?&ts=1589881281155

Regards,

Darren

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LM5109B: WSON Coplanarity Data