Greetings,
A customer need Thermal Resistance from junction to case (top side) of TPS50601-SP.
P/N: 5962R1022101VSC package CFP (HKH) | 20
do you have this info?
Thank u in advance.
Regards,
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Greetings,
A customer need Thermal Resistance from junction to case (top side) of TPS50601-SP.
P/N: 5962R1022101VSC package CFP (HKH) | 20
do you have this info?
Thank u in advance.
Regards,
Here is the full thermal model for the TPS50601-SP.
RθJA Junction-to-ambient thermal resistance = 24.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance = 7.0 °C/W
RθJB Junction-to-board thermal resistance = 8.9 °C/W
ψJT Junction-to-top characterization parameter = 1.6 °C/W
ψJB Junction-to-board characterization parameter = 8.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance = 0.6 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
Thanks
Christian