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TPS50601-SP: Theta JC top

Part Number: TPS50601-SP

Greetings,

A customer need Thermal Resistance from junction to case (top side) of  TPS50601-SP.

P/N: 5962R1022101VSC       package CFP (HKH) | 20

do you have this info?

Thank u in advance.

Regards,

  • Here is the full thermal model for the TPS50601-SP.

    RθJA Junction-to-ambient thermal resistance                  =          24.6  °C/W

    RθJC(top) Junction-to-case (top) thermal resistance       =            7.0  °C/W            

    RθJB Junction-to-board thermal resistance                      =           8.9  °C/W

    ψJT Junction-to-top characterization parameter               =           1.6  °C/W

    ψJB Junction-to-board characterization parameter           =           8.8  °C/W

    RθJC(bot) Junction-to-case (bottom) thermal resistance  =           0.6  °C/W

     

    For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

    Thanks

    Christian

  • Thank u so much