Do you have Power Dissipation graph of TLV743P?
(Power Dissipation vs Ambient Temperature.）
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We have two packages with similar thermal performance:
The X2SON package has a better TJA which can be used to predict the thermal performance based on TJ=TA+Power Dissipation*TJA.
For example, if VIN is 5V and VOUT is 2.8V, at 150mA of power dissipation:
(VIN-VOUT)*ILOAD is the power dissipation which would be (5-2.8)*0.15= 0.33W.
If the PCB ambient is ~40C, then the junction temperature would be:
This is assuming a JEDEC standard High-K board which actually is not optimized for thermal performance. Please see this application report for further details.
The SOT-23 will not benefit so much from an improved layout as it does not have a power pad. This is why RTJC(BOT) is N/A.
I have been working to get our thermal widget online for all of our devices. An example can be seen here. (You will have to scroll down)
I hope this helps to answer your question.