This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TLV743P: Power Dissipation data

Part Number: TLV743P

Hi team,

Do you have Power Dissipation graph of TLV743P?

(Power Dissipation  vs Ambient Temperature.)


  • Hi,

    We have two packages with similar thermal performance:

    The X2SON package has a better TJA which can be used to predict the thermal performance based on TJ=TA+Power Dissipation*TJA.

    For example, if VIN is 5V and VOUT is 2.8V, at 150mA of power dissipation:

    (VIN-VOUT)*ILOAD is the power dissipation which would be (5-2.8)*0.15= 0.33W.

    If the PCB ambient is ~40C, then the junction temperature would be:


    This is assuming a JEDEC standard High-K board which actually is not optimized for thermal performance. Please see this application report for further details. 

    The SOT-23 will not benefit so much from an improved layout as it does not have a power pad. This is why RTJC(BOT) is N/A. 

    I have been working to get our thermal widget online for all of our devices. An example can be seen here. (You will have to scroll down)

    I hope this helps to answer your question.