Hi team,
Do you have Power Dissipation graph of TLV743P?
(Power Dissipation vs Ambient Temperature.)
Regard.
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi team,
Do you have Power Dissipation graph of TLV743P?
(Power Dissipation vs Ambient Temperature.)
Regard.
Hi,
We have two packages with similar thermal performance:
The X2SON package has a better TJA which can be used to predict the thermal performance based on TJ=TA+Power Dissipation*TJA.
For example, if VIN is 5V and VOUT is 2.8V, at 150mA of power dissipation:
(VIN-VOUT)*ILOAD is the power dissipation which would be (5-2.8)*0.15= 0.33W.
If the PCB ambient is ~40C, then the junction temperature would be:
40C+0.33W*218.6C/W=112.1C.
This is assuming a JEDEC standard High-K board which actually is not optimized for thermal performance. Please see this application report for further details.
The SOT-23 will not benefit so much from an improved layout as it does not have a power pad. This is why RTJC(BOT) is N/A.
I have been working to get our thermal widget online for all of our devices. An example can be seen here. (You will have to scroll down)
I hope this helps to answer your question.