TPSM53603: PCB Air Gap Requirement

Furkan Fehmi Sefiloglu

Part Number: TPSM53603

Hi Team,

This is customer request, I would be very happy if you can assist.

We plan to use the TI TPSM53603 module on the PCB. However, due to the requirements of the project, we need to use a component or module that has an air gap on the PCB. Does the TPSM53603 contain any spaces in the package? A module filled with epoxy and similar material will be suitable for us. Can you help with this?

Thanks in advance

over 3 years ago

0 Jimmy Hua over 3 years ago

TI__Mastermind 47060 points

Hi Furkan,

Let me run this by our product engineer how might have more information on this. I'll get back to you once I heard from him hopefully by tomorrow.

Mind if I ask what the application is and why there is this specific requirement from the customer?

Regards,

Jimmy

0 Furkan Fehmi Sefiloglu over 3 years ago in reply to Jimmy Hua

TI__Expert 3118 points

Hi Jimmy,

They will use this module in a system that is shocked during launch. They will pack the PCB with epoxy into a metal box to increase the shock resistance. But modules with air gaps or air gaps on the PCB cannot take advantage of the epox's shock-dispersing effect and break more easily. That's why they try to select everything on the PCB as a solid mass without air.

Thanks in advance

Best Regards

Furkan Sefiloglu

0 Jimmy Hua over 3 years ago in reply to Furkan Fehmi Sefiloglu

TI__Mastermind 47060 points

Hi Furkan,

If the customer wants to use a power module that does not have airgaps then the TPSM53603 should suffice. The module is completely overmolded and any spaces should be filled with the mold compound.

Regards,

Jimmy

Power management

Power management forum

TPSM53603: PCB Air Gap Requirement