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TPSM53603: PCB Air Gap Requirement

Part Number: TPSM53603

Hi Team, 

This is customer request, I would be very happy if you can assist.

"

We plan to use the TI TPSM53603 module on the PCB. However, due to the requirements of the project, we need to use a component or module that has an air gap on the PCB. Does the TPSM53603 contain any spaces in the package? A module filled with epoxy and similar material will be suitable for us. Can you help with this?

"

Thanks in advance

  • Hi Furkan,

    Let me run this by our product engineer how might have more information on this. I'll get back to you once I heard from him hopefully by tomorrow.

    Mind if I ask what the application is and why there is this specific requirement from the customer?

    Regards,

    Jimmy 

  • Hi Jimmy,

    They will use this module in a system that is shocked during launch. They will pack the PCB with epoxy into a metal box to increase the shock resistance. But modules with air gaps or air gaps on the PCB cannot take advantage of the epox's shock-dispersing effect and break more easily. That's why they try to select everything on the PCB as a solid mass without air.

    Thanks in advance

    Best Regards

    Furkan Sefiloglu

  • Hi Furkan,

    If the customer wants to use a power module that does not have airgaps then the TPSM53603 should suffice. The module is completely overmolded and any spaces should be filled with the mold compound. 

    Regards,

    Jimmy