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CSD88539ND: Theta-J Case Specification

Stuart Baker
Genius 10460 points
Part Number: CSD88539ND

The data sheet refers to the case temperature in multiple places, but I cannot find the Theta-J Case specification. Is this available?

Thanks,

Stuart

  • 0
    TI__Mastermind 34275 points

    Hi Stuart,

    Thanks for the inquiry. TI does not specify RthetaJC for this SO8-packaged dual FET. The only specs we provide in the datasheet are RthetaJA and RthetaJL (junction-to-lead). The primary path to remove heat from an SO8 is thru the leadframe - pins - PCB. We typically do not spec RthetaJC to the top of the package. The closest comparable I have is for a 5x6 wire bond SON package. Based on the die size, I would estimate RthetaJC to top of the package around 30 to 35 degC/W.

    You may find the blog below useful. I'm going to close this thread. Please contact me via regular email if you have additional questions.

  • 0 in reply to John Wallace1
    TI__Genius 10460 points

    John,

    Thank you for your response. I performed some comparative testing by looking at the drain lead temperature on one of the FET's (compared to the case temperature). I can confirm that your guess of 30 to 35 degC/W are in line with what I observed.

    Thanks,

    Stuart