We are interested in the UCC5390ECDWV. The layout guidelines require that there is no copper under the driver in the layout.
I suppose this is only a matter of the insulation problem with dirt.
We can only use the driver if the area under the component in the multilayer is kept free of copper in the top layer (assembly side) only.
This is not possible in the other layers.
Can you please clarify the background?
Or are there functional reasons for this layout requirement?