TPS62160-Q1: Request for Thermal expansion coefficient, Heat capacity, Heat conduction coefficient, Heart flux from IC chip 6 faces data

PYTsai,

I am unable to find this information at the moment. I have contacted the packaging team to see if they have these details.

Regards,

Amod

PYTsai,

We do not a thermal expansion coefficient (CTE) for the device as a whole but can break the CTE down to the core components of the device where these values can be used in modeling. Is this what you are looking for?

For the other thermal parameters you request, the only data available is in the datasheet's thermal information section 7.4.

Regards,

Amod

Hi Amod,

Yes, it is what we are looking for. Can you help provide thermal expansion coefficient (CTE) first. 

For other thermal parameters, do you know whom should i request to ? thanks!

PYTsai,

I have requested information on CTE from packaging team but have no estimate on the timeline yet. I will let you know once I get an update. I checked with packaging team on thermal params too and they confirmed that what we have in the datasheet is all the information we can provide.

Regards,

Amod