Hi
May i know how to get below data for TLV73333PQDRVRQ1
Thermal expansion coefficient,
Heat capacity,
Heat conduction coefficient,
Heart flux from IC chip 6 faces
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Hi
May i know how to get below data for TLV73333PQDRVRQ1
Thermal expansion coefficient,
Heat capacity,
Heat conduction coefficient,
Heart flux from IC chip 6 faces
Hello,
I have consulted the team responsible for performing thermal analysis for PDS. They say that it is possible to estimate a composite parameter for the package CTE, but not for the other properties. The heat flux per side and heat conduction coefficient will depend on the mounting conditions, so we cannot provide an estimate for that.
Do you still want an estimate for the package CTE then?
Best regards,
Nick
Hello,
The thermal team is working on the request for the package CTE. They will provide the estimate by next week.
Best regards,
Nick
Hello,
Here is the package CTE report. Please let me know if there are any issues.
PkgCte_V73333PQDRVRQ1_6_WSON_DRV.PPTX
Best regards,
Nick