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TLV758P: About the junction temperature (6pin WSON package)

Part Number: TLV758P


Could you tell me how calculate the  junction temperature base on the case(top) temperature?

 The case(top) temperature is 95.26℃ and the Power consumption is 0.51W in measurement

If I use the <Junction-to-case (top) thermal resistance> RθJC(top) is 98.7℃/W

the   junction temperature Tj= 95.26+0.51*98.7=145.6℃ and over the operating temperature(125℃)

However, If I use the <Junction-to-top characterization parameter> ψJT is 6.1℃/W  the Tj will be 98.37℃

What difference about the RθJC(top) and ψJT?

And any other methods to junction temperature?

Thank you

Best regards!

  • Hi Ken,

    ψJT is the correct parameter to use. The difference between this and RθJC(top)  is that RθJC(top)  is just one of the thermal resistances from the junction to the outside of the package.  ψJT is a characterization parameter which is used to estimate the die temperature based on the temperature measured at the top of the case. 

    So please use ψJT to estimate the die temperature in the application.

    I hope this answers your question.