This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

CSD18510KCS: PIN hot air solder leveling area

Part Number: CSD18510KCS

Hi Team,

SOLTEAM IQC response CSD1851KCS have PIN hot air solder leveling area evenness issue, please help clarify the Red square block in picture..

  • Hi Kevin,

    Thanks for promoting TI FETs at your customer. I am checking with the packaging engineer on your question. I will get back to you as soon as I have more information.

  • Hi Kevin,

    Below is feedback from our packaging engineer. Can you please provide some additional details on how the lead-forming is being done. Is this done by a 3rd party?

    From TI packaging engineer:

    CSD18510KCS is in TO-220 package. The package is shipped in straight pin, no forming,
    and plated by electrolytic Sn plating process.

    The picture customer shown had pins bent (opposite direction to what other

    Customer would bend) and it was mentioned Hot Air Solder Leveling (HASL).

    Does the customer bend the leads through a third party and then plated the pins
    using HASL process?

    The electrolytic tin plating process would result in a very smooth tin surface.

    We never have customer feedback seeing a non-smooth tin surface.

  • Hi Team,

    As in the photo, is this tin plating is OK?
    In this lot# MOSFETs, there will be incomplete pin plating. Is this correct?
  • Hi Kevin,

    It appears that there is exposed copper on the lead shown in the photo. We suspect this may be occurring during the lead-forming process with the leads come in contact with the tool used to bend them. However, we cannot be certain as there is no information on how the lead-forming is done and we do not have any photos before the leads were bent. Are there other FETs from the same lot that can be photographed prior to lead-forming? Or, perhaps we can get some before and after photos of the leads.

  • Hi Kevin,

    Just following up to see if you have any additional information to share with TI. If not, then I would like to close this thread. I'll wait for your response before closing.

  • Hi Kevin,

    Thanks again for your inquiry. I am going to close this thread. If you have any additional questions, please feel free to respond.