Hello, we are working on Wireless Power Transfer and we are using your product LMG1025 and trying to add LMG3410R070 in out designs. As we know and also you have mentioned in technical documents of LMG3410R070, the PARASITIC INDUCTANCE in drain and source (including WIREBONDS, interconnects, and package parasitics) of the power transistor are VERY IMPORTANT and will highly affect on the performance and degrade it from what we expect.
I reviewed the SPICE MODEL of LMG3410R070 and no where these inductors are modeled. Also, the parasitic inductors in SUPPLY of the CMOS driver which is realy important. I use EM simulation for extracting PCB parasitics but I don't have any estimation about the parasitics in the package and haven't modeled them.
I was wondering if you could provide me some detailed information about those above mentioned parasitics to have more accurate simulations and be more similar to reality.