Hello,
I am planning to use the UA78L12AC in the SOT-89 package in a design that requires <50mA. I see the data sheet states that the package has a 54.7°C/W junction to ambient thermal resistance. Is this achieved in conjunction with the layout example shown on page 13 of the data sheet? If not and if we do not want to use a heat sink, besides maybe enlarging the ground plane and having more vias to ground is there another layout consideration we can make?
Thank you,
Thi Le