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CSD25480F3: CSD25480F3 thermal resistance

Part Number: CSD25480F3

HI sirs, 

   Do you have CSD25480F3 thermal  resistance JC (junction to case)  number? Please share the value to me.

  • Hi Alan,

    Thanks for the inquiry. TI does not spec Rθjc for these small devices since there is no actual case. FemtoFETs like the CSD25480F3 are chip scale parts with land grids for soldering to the PCB. There is no case or plastic package (i.e. the junction is the case). The packaging team has done some thermal simulations on a similar but larger FET: CSD22205W. For this part mounted on 1 sq. inch copper, the estimated Rθjc(bottom) is about 25degC/W. Since the CSD25480F3 is about 1/3rd the area, this number will be larger by 2x to 3x. However, we have no data on this particular FET. I'm including links below to some useful technical articles. For these tiny FETs, the maximum power dissipation capability is limited to about 0.5W.