Hi,
We were wondering if there were any tips regarding hand-soldering the lmg1210. We are currently utilizing the following steps:
1. apply solder paste on each of the pads
2. place component by hand
3. heat board to 150 degC with heat plate beneath PCB
4. use heat gun closely above component with following profile - 200 degC, 40s ; 240 degC, 30s ; 260 degC 12s
In general it is difficult to ensure that the same amount of paste is applied on each pad. We also typically see a resistance (hundreds of Ohms scale) forming between the PWM input and the ground, which we believe is due to a small solder bridge or residual paste between LI/HI and GND. In the current approach, the procedure needs to be iterated until the soldering is successful. Any proposed improvements to the assembly would be appreciated.
Best,
Michael D'Antonio
