Other Parts Discussed in Thread: LM317-N, LM317, LM1086
The DS for the TL1963A lists the ABS MAX VIN and VOUT as ±20V.
Then it lists the MAX Input-Output Voltage differential as 20V.
A lot of LDO's just list the MAX Input-Output Voltage in the DS.
I have a customer considering another vendor's device, and I really like the package-size / output power / thermal characteristics of the DCQ package for the TL1963A.
The problem is, the device would need to support an Input-Output voltage differential of 1.4V, with VIN = 26.4V and VOUT = 25V, with a max 1.1A load current.
This is a really unique case...but yes, these are the input/output requirements.
There is also some inrush current needs based on the output bus capacitance.
I know the DS lists the ABS MAX VIN and VOUT as ±20V, but is there some internal device structure reason why going up to say 27V or 30V for VIN could damage or destroy the device? Or is this VIN/VOUT just based on the max voltage drop across the internal pass element the device can support?
Can we run a characterization/simulation to see if the device might be able to support a higher input voltage - up to 26.4V and output voltage - 25V?
If this needs to be taken offline, I am in the directory.
PS: I did find the LM317-N, which looks perfect...but there was some reason I didn't like it...but I can't remember what it is now...fa
The LM317 doesn't have the DCQ package, so ℃/W is almost 10℃/W higher for LM317 DCY package than for TL1963A DCQ package.
third party device lists, for a package "similar" to the DCY, a thermal Tja of around 22℃/W, and list both JESD specs for single layer / four layer measurements...this is just crazy thermal performance...and it is the one thing we really need, besides a small package....I am having trouble finding a good fit.