CSD19532Q5B: CSD19532Q5B; Thermal information of package

Kento Sato

Intellectual 950 points

Part Number: CSD19532Q5B

Hi team,

Please let me know this.

1. linear thermal expansion coefficient package

2. thermal conductivity of package

Best regards,

Kento

over 5 years ago

0 John Wallace1 over 5 years ago

TI__Mastermind 40610 points

Hello Sato-san,

Thanks for promoting TI FETs at your customer. The CTE for this package is 25ppm/degC. The thermal conductivity of the package plastic mold compound is 0.9W/mk.

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CSD19532Q5B: CSD19532Q5B; Thermal information of package