UCC27712: Device fab process

Derek Pelotte

Part Number: UCC27712

Hello,

I am conducting a reliability trade study and am curious what the fab process (i.e. CMOS, BiCMOS, Bipolar, ect) is used on this part?

over 4 years ago

0 Mamadou Diallo over 4 years ago

TI__Genius 13445 points

Hi Derek,

We're looking into this and will get back to you.

Regards,

-Mamadou

0 Richard Herring over 4 years ago

TI__Mastermind 23215 points

Hello Derek,

The fab process of the UCC27712 is based on CMOS process.

Confirm if this addresses your questions or you can post additional questions on this thread.

Regards,

0 Derek Pelotte over 4 years ago in reply to Richard Herring

Prodigy 210 points

Hi Richard,

This does answer the question. I appreciate your help.

0 Richard Herring over 4 years ago in reply to Derek Pelotte

TI__Mastermind 23215 points

Hello Derek,

Thanks for confirming, and I will go ahead and close this thread. If you can do us a favor and press the green button that we resolve your issue, we would appreciate.

Regards,

0 Derek Pelotte over 4 years ago in reply to Richard Herring

Prodigy 210 points

Hi Richard, I want to revisit this. I have found a different fab process from the reliability data on TI's website. You said CMOS, but the link below claims BiCMOS. These lead to different reliability concerns so I'd like to just get confirmation one way or the other.

Thanks

www.ti.com/.../report

+1 Richard Herring over 4 years ago in reply to Derek Pelotte

TI__Mastermind 23215 points

Hello Derek,

Yes specifically the high voltage drivers are on a high voltage process based on BiCMOS. I apologize for not being more specific before, as BiCMOS is a variant of CMOS in general.

Regards

Power management

Power management forum

UCC27712: Device fab process