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TPS55340: Layout exapmle for HTSSOP package

Part Number: TPS55340
Other Parts Discussed in Thread: TPS40210EVM

Hello team,

Could you please provide the TPS55340 layout example for HTSSOP package option?

How much width do you recommend for AGND?



  • Hi Itoh-san,

    Thank you for reaching out.  Unfortunately we don't have a ref design using the HTSSOP package.  However, there are other HTSSOP packages which you may take a reference.  Regarding AGND, it should be a polygon but not just a trace.  Please refer the the TPS40210EVM layout, for which the AGND is a polygon of a rectangular shape around the IC with a clearance around the polygon to separate it from PGND copper plane. 

    Hope this helps.


    Youhao Xi, applications Engineering

  • Hello team,

    I am Ryuzo . TTEC engineer.

    Thank you for your information.I have below question.

     How thick should I connect AGND and PGND?

    Best Regards,

  • Hello Ryuzo,

    If all components are connected as recommended to AGND and to PGND, there should not be a high current flow from AGND to PGND, so the connection does not need to be extremely wide. It seems to be ok in your picture. But please check your layout in general that PGND current does not take accidentally the AGND area.