Other Parts Discussed in Thread: TPS40210EVM
Could you please provide the TPS55340 layout example for HTSSOP package option?
How much width do you recommend for AGND?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Thank you for reaching out. Unfortunately we don't have a ref design using the HTSSOP package. However, there are other HTSSOP packages which you may take a reference. Regarding AGND, it should be a polygon but not just a trace. Please refer the the TPS40210EVM layout, for which the AGND is a polygon of a rectangular shape around the IC with a clearance around the polygon to separate it from PGND copper plane.
Hope this helps.
Youhao Xi, applications Engineering
If all components are connected as recommended to AGND and to PGND, there should not be a high current flow from AGND to PGND, so the connection does not need to be extremely wide. It seems to be ok in your picture. But please check your layout in general that PGND current does not take accidentally the AGND area.