TPS562202S: Problems with new custom design.

MikeH

Part Number: TPS562202S

Can the Enable pin be tied directly to Vin? I have a new custom prototype board that has two blown TPS562202S chip on first power-up. Two other boards work fine. I used the WebBench design for both. Vin is ~+12V.

over 3 years ago

0 Jiandong Liu over 3 years ago

TI__Intellectual 1801 points

Hi MikeH，

Yes, you can. I don't see any problems from the schematic and layout.

Regards,

Jared.

0 MikeH over 3 years ago in reply to Jiandong Liu

Guru 15580 points

Turns out it was the grounding vias that your datasheet recommends placing directly underneath the device. The tented vias lifted the chip enough to cause a solder void on the pins on one side of the device. Once these pins were properly connected, the device worked as advertised.

I HIGHLY RECMOMEND NOT PLACING (TENTED) VIAS DIRECTLY UNDER THE DEVICE.

0 Edwin Zang over 3 years ago in reply to MikeH

TI__Expert 6425 points

Hi Mike,

Good suggestion. SOT563 package size is only 1.2mmx1.2mm which is very small. So we don't suggest to place vias under the device. It's suggested to just place ground line under device.

it's suggested to add a 0.1uF input cap at input port which can help to filter high frequency noise.

BRs,

Edwin.

0 MikeH over 3 years ago in reply to Edwin Zang

Guru 15580 points

Edwin,

You may want to let your documentation folks know also.

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TPS562202S: Problems with new custom design.