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RE: PTD08D210W: Recommended land pattern

Other Parts Discussed in Thread: PTD08D210W, PTD08A020W

Hello Anthony,   I am interested in defining the thermal interface definition for this component.   I saw land pattern question and opted to add to it.   I do not see a page 19 on the following document link.     Per your reply to Y. Ottey, the heat comes out of the bottom of the component and the intent is to dissipate it to the PWB.  Is this correct?   If you would point me to a section on the datasheet or an application note to confirm this, I'd appreciate it.    Daniel.   Or email me directly at dsando@sandia.gov       For example, for component PTD08D210W there is an explicit callout for thermal interfacing via a thermal pad in the Terminal Functions section. 

https://www.ti.com/lit/ds/symlink/ptd08a020w.pdf?ts=1615820661860