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TPS74801: Thermal Performance with adjusted layout/footprint.

Part Number: TPS74801


We currently use the TPS74801 with the recommended layout, but we are considering adjusting our stencil to exclude solder on the 4 extrusions suggested in the datasheet as shown below:

Would there still be sufficient thermal dissipation?



  • Hi Yale,

    The numbers reported in our datasheets assume a board layout replicating the JEDEC standard.  You can obtain better thermal performance than this if you place more thermal copper on your boards.  If you adjust the stencil as you are suggesting, you may or may not have sufficient thermal dissipation depending on your board layout and actual power dissipation levels across the device. 

    Fortunately you can use the following app note on actual hardware to obtain the actual junction-to-ambient thermal resistance of your layout.


    - Stephen