Hi team,
Good day.
Could you provide reflow profile for REG1117FA/500?
Regards,
Takahashi
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Hi team,
Good day.
Could you provide reflow profile for REG1117FA/500?
Regards,
Takahashi
Hi Takahashi-san,
We don't have a reflow profile for a particular device. Please this reflow profile for general use. I would recommend getting this information from board manufacture or assembly companies.
https://www.ti.com/lit/an/snoa292j/snoa292j.pdf
Regards,
Jason Song
Hi Jason-san,
Thank you for your support.
I referred the reflow profile from JEDEC J-STD-020.
I have question about reflow peak temperature.
I checked reflow peak temperature from JEDEC J-STD-020.
My check result is 245 degrees.
Because Package body size (mm) is 8.36x10.16x4.44, so Volume is 377mm3. Package Thickness is over 2.5mm.
Also I checked product information on website.
MSL rating/Peak reflow for REG1117FA-5.0/500 is Level-2-260C-1 YEAR in website.
So this component reflow peak temperature is 260 degrees.
Which should I judge at 260 degrees or 245 degrees for reflow peak temperature?
Regards,
Takahashi
Hi Takahashi-san,
Please allow some time for us to talk to our team members to see if this is the question we could help to answer. I will get back to you early next week.
Regards,
Jason Song
Hi Takahashi-san,
I am sorry but we were not able to provide additional comments on the peak temperature for the reflow process, I would strongly recommend getting this information from the board manufacture.
Regards,
Jason Song
Hi Jason-san,
I will ask and get this information from the board manufacture.
Thank you.
Regards,
Takahashi