Could TI please provide guidance for how to trim/form the leads of ceramic devices and provide the PCB footprints so we can integrate into our system design?
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The PCB footprint for ceramic devices is typically a secondary product of a targeted trim and form profile. Specifications on the trim and form profile vary from customer to customer. Customers will often have additional trim/form requirements to meet assembly and board level reliability (BLR) goals. The space power business unit of Texas Instruments uses the services of sub-contractor Fancort to derive trim and form profiles, and hence, PCB footprints, for its ceramic devices. The footprint is associated with a trim/form specification generated to mount devices to EVMs, and may or may not be appropriate for a customer's end use. The footprint provided by Texas Instruments is for reference only. Customers should contact Fancort to obtain the trim/form profile for ceramic devices mounted to EVMs as Fancort controls this specification. TI controls the PCB footprint drawings used on EVMs. Accessing pcb footprints is described in the instructions that follow.
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