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UCC28610: Thermal resistance v.s. Characterization parameter

Charles Zhang1
Expert 3080 points
Part Number: UCC28610

Hi team,

If equation(8) in https://www.ti.com/lit/an/spra953c/spra953c.pdf?ts=1620011135751 is recommended to estimate junction temperature, why we still need to list RθJC(top) in the datasheet?

What's the scenario to use RθJC(top)? Thanks.

Regards,

  • +1
    TI__Mastermind 44770 points

    Hi Charles,

    RΘJC(TOP) is just one of the thermal resistance paths from the die to outside the package. For estimating the actual die temperature in the application. ΨJT is the right parameter to determine the actual die temperature in the application.

    RΘJC is provided just for informational purposes. 

    Does this answer your question?