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TLV700: WSON Thermals

Mark Ackerson
Genius 10190 points
Part Number: TLV700

Why is the TLV700 SC70 package so much better thermally than the WSON?  I would have expected the leadless package to be much better than a leaded package, but that does not seem to be the case.

Thanks,
Mark

  • 0
    TI__Genius 12345 points

    Hi Mark, 

    It is important to note that package size and PCB design affect the thermal performance of the device.

    In this case, if the package is bigger, it will have a better RθJA. Moreover, having larger conduction paths and/or larger contact planes helps improve the thermal performance talking about PCB design.

    Furthermore, when power dissipates, it escapes as heat, therefore if there is a larger area where this heat can escape i.e having  leads, larger package size, it will contribute to having less thermal resistance. The same principle applies to the previously mentioned PCB design. 

    I hope this answers your question. Thank you for the patience. If you have more questions do not hesitate in reaching out to us. 

    Best, 

    Edgar Acosta

  • 0 in reply to Edgar Acosta1
    TI__Genius 10190 points

    Hi Edgar,

    Thanks for the detailed explanation.

    Regards,
    Mark