BQ27425-G1 - PCB Routing Question

Phillip Karls

Prodigy 250 points

Other Parts Discussed in Thread: BQ27425-G1

Is there any documentation outlining how to "fanout" the BQ27425-G1?

Looking at the evaluation module documentation it looks like they put a via right in the pad itself.

Can anyone confirm this or point me to discussion regarding this?

Thanks,

Phillip

over 9 years ago

0 Ryan May over 9 years ago

TI__Genius 13700 points

Hello Phillip,

While I have not been able to find a dedicated document for this part I would recommend reviewing the EVM layout seen in the EVM User Guide in the context of some other materials.

You could look at the BGA routing wiki here:

http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design#PCB.C2.A0Routing_Methods

-While this is primarily for Processors but many of the same ideas apply.

You could also look at this guide for 0.5mm pitch package layout guideline which starts on Pg. 15 of this PDF:

http://www.ti.com/lit/ug/spru811a/spru811a.pdf

There are a few other documents that discuss the topic of layout for BGA style packages but hopefully this will give you a great starting point.

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BQ27425-G1 - PCB Routing Question