Hola,
We have project use CSD18501Q5A design in power rail control, I saw the thermal pad dimensions is very large.
But can’t find any document mentions need add via on pad to reduce thermal. Does TI have any recommend for this ?
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Hola,
We have project use CSD18501Q5A design in power rail control, I saw the thermal pad dimensions is very large.
But can’t find any document mentions need add via on pad to reduce thermal. Does TI have any recommend for this ?