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Hi, My customer has question about LM25575. Could you tell us about question?
Q: Is Power pad direct connected to AGND and PGND in internally ?
The exposed pad is connected to the back side of the silicon for heat dissipation purpose. I don't think it is electrically connected to AGND or PGND on the die. It is recommended to have a good connection to the ground copper on top the PCB,. also vias to other layers of PCB, to have the best possible thermal dissipation path.
TI Wide Vin Buck Converter & Controller Applications Engineer
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