This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi Team,I looked Layout Guidelines and have following questions.question 1) Could you tell me the recommended value of the capacitor that should be connected between VDD and VSS?I would also like to know the value of bootstrap capacitor that should be connected between HB and HS.question 2)Could you tell me the recommended value of the capacitor that should be connected between the drain of the top MOSFET and VSS?I would also like to know if it is possible to put ceramic capacitor although electrolytic capacitor is recommended.Best Regards,Yaita / Japan disty
Thank you for your interest in LM5107. Regarding your please questions, see below:
1) The capacitor between VDD and VSS placed as close as possible to the IC can be a small value. Typical values are 0.1uF or 0.22uF. This will depend on the magnitude of transient currents when the driver switches. Note that one or two larger capacitors (e.g. 1uF, 10uF) should be connected in parallel with this small cap, although these can be placed slightly further away from the IC.
The bootstrap cap between HB and HS can also be a 0.1uF. The goal is to ensure that the voltage from HB to HS remains at the desired voltage range to turn the high-side FET ON during normal operation, so this value could be made smaller (or larger) depending on how the system is performing.
2) The selection of the capacitor for the DC main depends on the system requirements, but 10uF would be a typical value. Ceramic capacitors can be used here, but note that ceramics are best for high frequency and large-value electrolytic capacitors are good for low frequency.
The following app notes from TI provide some good insight on input/output cap selection:
SLTA055 -- Input and Output Capacitor Selection
Ceramic or electrolytic output capacitors in DC/DC converters
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.