Other Parts Discussed in Thread: TIDA-00702,
Hello black magic wizards.
I have seen a lot of application notes concerning layout guidelines for switch mode power supplies. Most of them based on a 2 layers PCB stackup.
In our design we will be using a 4 layers PCB stackup, the board also has a digital circuitry based on a TM4C MCU.
The SMPS we are using is similar to the primary side of the one found on TIDA-00702. We want to follow best EMC practices and guidelines.
For minimizing EMI what should we do about the ground plane layer, from what I know splitting the ground plane generates high EMI:
- Remove the ground plane completely under the SMPS (before isolation) part of the circuit
- Divide the board ground plane to 2 copper shapes, one under the SMPS (before isolation) connected to neutral (or should it be earth ?). Another under the digital (isolated) section connected to DC ground.
- Separate the PCB boards. Have one with two layers for the SMPS and another one 4 layers for the digital with power wires running from one to another.
Thanks