UCC27525: about thermal pad

Hi ACGUY,

LOVE your name!!!

The thermal pad is loosely tied to the GND pin through the substrate of the IC. We don't control the impedance here, so you may measure 10s to 1000s of ohms between the GND pin and the thermal pad. Best practice is to connect the thermal pad to a large ground flood on your PCB to help remove heat from the IC and improve board-level reliability (the thermal pad gives a large connection to the PCB to help hold the part to the PCB better).

The DSD package option has the thermal pad. The D, DGN, and P package options do not have the thermal pad. Figure 39 is for the D and DGN options since those don't have a thermal pad. Thus, it is ok to route the traces under the body of the IC. Pages 35 and onwards have mechanical drawings and recommended footprints for the various packages.

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Hi ACGUY,

Sorry I was not clear. Yes, the thermal pad should be connected to ground.