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CSD19535KTT: Thermal Resistance Junction to Top

Kevin Den Toom
Prodigy 450 points
Part Number: CSD19535KTT

Hi Team,

the datasheet specifies the following thermal resistance.

Can you please specify in more detail in respect to which part of the case (i.e. top or bottom) the parameter is given ?

Do you have thermal heat maps?

  • In case it is specified in respect to the case bottom is there any way to calculate Junction-to-case top thermal resistance (e.g. some coefficient that depends on the package).

Do we have thermal coefficients for different packages or app notes that specify thermal coefficients?

Best Regards

Kevin den Toom

  • 0
    TI__Expert 6815 points
    Kevin,

    Thanks for posting
    I am in discussions with our packaging team and expect to be able to respond within 24hrs

    Best Regards
    Chris
  • 0
    TI__Expert 6815 points
    Kevin,

    You can assume a thermal resistance through the top of the package of about 6degC/W, this number is dependent upon the die size and as such is not a generic number for all D2Pak devices and only for this specific device.
    We do not have thermal heat maps.
    When talking about the case in a D2Pak device this will be a point directly under the silicon die on the exposed leadframe or drain pad.
    We have no specific app note on thermal resistance for different packages, though you raise a good point and this may be a worthwhile activity for us to do. In the mean time just come to us and we can supply the information you need.

    Best Regards
    Chris