Hi,
I am using the TPS542941 in the RSA pacakage. I have two questions in regards to using this part:
1 - On the datasheet, p17, it shows a sample layout of this part and i can see that PGNDx is NOT connected to the thermal pad's ground. But on p16 it show the sample layout for the HTSSOP package and the PGNDx IS connected to the thermal pad's ground. Why is there a difference in the connection of PGNDx between the two packages and can you please confirm for the RSA package which i am using, should i follow the datasheet and NOT connect it to the thermal pad ground?
2 - My design is very compact and i am not using this part at the maximum current rating and as such, my inductor is smaller. In the datasheet P17 which shows the sample layout, it suggest that i keep output caps ground vias at least 25mm from the input caps ground vias. I do not have sufficient physical space to do this as my inductor is only 4mm square. Do i still add output cap vias directly below the caps or do i need to move these ground vias so that they are at least 25mm away? Or is this 25mm a typo and should be 25mil (0.025") as in the previous page it inidcates 3-4mm?
Thanks