Hello,
I need for the following θ junction-to-case. Note part number show EP on suffix.
TPS54610MPWREP HTSSOP-28, PWP package
Thank you,
HSG
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Hello,
I need for the following θ junction-to-case. Note part number show EP on suffix.
TPS54610MPWREP HTSSOP-28, PWP package
Thank you,
HSG
High Speed Guy,
Just to clarify, that Theta JC of 28.2 C/W is junction to case TOP. For PowerPAD package it is not a very useful parameter as nearly all the internal heat is dissipated thru the PowerPAD, not the case top. You can use all of the thermal parameters of the TPS54610 datasheet for the EP device:
See:
For a full explanation of the thermal parameters. Junction to board thermal resistance of 15.1 C/W is likely the parameter you are interested in.